Electrode sandwich separation

ABSTRACT

Materials bonded together are separated using electrical current, thermal stresses, mechanical force, any combination of the above methods, or any other application or removal of energy until the bonds disappear and the materials are separated. In one embodiment the original bonding was composed of two layers of material. In another embodiment, the sandwich was composed of three layers. In a further embodiment, the parts of the sandwich are firmly maintained in their respective positions during the application of current so as to be able to subsequently align the materials relative to one another.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional application of U.S. patent applicationSer. No. 10/234,498, filed Sep. 3, 2002, which application claims thebenefit of Provisional Patent App. No. 60/316,918, filed Sep. 2, 2001.

BACKGROUND OF THE INVENTION

The present invention relates to fabrication of matching pairs ofelectrodes.

WO99/13562 and U.S. Pat. No. 6,417,060 disclose applications for whichit is beneficial to have two separated surfaces which substantiallymirror each other, and methods for making pairs of electrodes whosesurfaces replicate each other are disclosed therein. The methods involvefabricating a composite by providing a first electrode with asubstantially flat surface and placing a sacrificial layer over it. Asecond material, which will form the second electrode, is placed overthe sacrificial layer. The composite is then ‘split’ into two matchingelectrodes by removing the sacrificial layer by etching, by cooling thesandwich with liquid nitrogen, or by heating to evaporate thesacrificial layer.

A possible drawback of using a sacrificial is that it can dull somefeatures of a surface to be matched and thereby degrade the quality ofthe surface matching. Additionally, incomplete removal of thesacrificial layer, or damage to one of both of the surfaces by thetechniques used for removing the layer would be deleterious to thequality of the surface matching.

The present invention offers an improved means for providing pairedelectrodes that dispenses with the need for a sacrificial layer.

SUMMARY OF THE INVENTION

From the foregoing, it may be appreciated that a need has arisen for amethod of separating bonded materials for use as electrodes or for otheruses, to achieve clean separation of the two surfaces, which allows thesurfaces to remain aligned with one another, and which does not involvea sacrificial layer. This method may be used to prepare matched surfacesthat may be positioned in close proximity to each other, with separationdistances on an Angstrom scale.

In general terms, the present invention provides a method formanufacturing a pair of electrodes comprising the steps of: fabricatinga first electrode with a substantially flat surface; placing a secondmaterial over the first electrode, wherein said second materialcomprises a material that is suitable for use as a second electrode; andseparating the composite so formed along the boundary of two layers intotwo matched electrodes. A technical advantage of the present inventionis that surfaces that mirror one another may be created without the needfor a sacrificial layer. A further technical advantage of the presentinvention is that the bonded layers may be separated cleanly, with noremnants of one material on the layer opposing.

In accordance with one embodiment of the present invention, theseparation step is achieved by applying an electrical current throughthe materials to separate the electrodes along the boundary of twolayers. A technical advantage of this aspect of the present invention isthat bonded materials may be easily separated without applyingmechanical tension to the materials.

In accordance with a further embodiment of the present invention, theseparation step is achieved by cooling or heating the materials, so thatthe differential in the Thermal Coefficient of Expansion (TCE) betweentwo materials breaks the adhesive bond between the two materials.

In accordance with a further embodiment of the present invention, theseparation step is achieved by forcible separation of the two materialsto break the adhesion between the two materials. A technical advantageof this aspect of the present invention is that the method may notinvolve applying or removing heat during the separation process.

In accordance with the present invention, a method of separatingmaterials from one another is provided, comprising the addition orremoval of energy, for example by means of an ultrasonic treatment step.

In accordance with a further embodiment of the present invention, theseparation step is achieved by combination of two or more of the priormethods.

The present invention describes a method for separating surfaces. Thesesurfaces could take many forms, including but not limited to electrodes.

The present invention also describes separating bonded surfaces. Thesesurfaces can be bonded through a variety of methods as described in thedetailed description of the invention.

Other technical advantages of the present invention will be readilyapparent to one skilled in the art from the following figures,descriptions, and claims.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE INVENTION

Embodiments of the invention will now be described with reference toappropriate figures, which are given by way of example only and are notintended to limit the present invention.

For a more complete explanation of the present invention and thetechnical advantages thereof, reference is now made to the followingdescription and the accompanying drawings, in which:

FIG. 1 is a diagrammatic representation of one embodiment of theelectrode configuration of a Gap Diode, Power Chip or Cool Chip, showingpiezo-electric actuators at intervals along the under-surface of anelectrode;

FIG. 2 a illustrates two bonded materials undergoing an electricalcurrent application, which breaks the bonds between the materials;

FIG. 2 b illustrates two bonded materials undergoing a thermal cycle,which breaks the bonds between the materials;

FIG. 2 c illustrates two bonded materials undergoing an application ofmechanical force, which breaks the bonds between the materials;

FIG. 2 d illustrates two bonded materials undergoing a combination oftwo or more of the prior methods, which breaks the bonds between thematerials;

FIG. 2 e illustrates energy being applied to two bonded materials, whichbreaks the bonds between the materials;

FIG. 3 is a diagrammatic representation of an electrode composite on asilicon wafer;

FIG. 4 a a shows a composite intermediate; and

FIG. 4 b shows a pair of electrodes derived from a compositeintermediate.

DETAILED DESCRIPTION OF THE INVENTION DEFINITIONS

“Power Chip” is hereby defined as a device that uses a thermal gradientof any kind to create an electrical power or energy output. Power Chipsmay accomplish this using thermionics, thermotunneling, or other methodsas described in this application.

“Cool Chip” is hereby defined as a device that uses electrical power orenergy to pump heat, thereby creating, maintaining, or degrading athermal gradient. Cool Chips may accomplish this using thermionics,thermotunneling, or other methods as described in this application.

“Gap Diode” is defined as any diode which employs a gap between theanode and the cathode, or the collector and emitter, and which causes orallows electrons to be transported between the two electrodes, across orthrough the gap. The gap may or may not have a vacuum between the twoelectrodes, though Gap Diodes specifically exclude bulk liquids or bulksolids in between the anode and cathode. The Gap Diode may be used forPower Chips or Cool Chips, for devices that are capable of operating asboth Power Chips and Cool Chips, or for other diode applications.

The embodiments of the present invention and its technical advantagesare best understood by referring to FIGS. 1-4. While in this descriptionof the present invention specific methods are disclosed for separating acomposite electrode intermediate into two matched electrodes, theseshould not be construed as limiting the scope of the invention but asmerely providing illustrations of some of the presently preferredembodiments of this invention. Similarly, although FIGS. 1 and 2 showschematics of various diode devices described in U.S. Pat. No.6,417,060, which use actuators, preferably piezo-electric actuators, tocontrol the separation of the electrodes, these also should not beconstrued as limiting the scope of the invention but as merely providingillustrations of some of the presently preferred embodiments of thisinvention.

Further, electrode pairs fabricated according to the methods of thepresent invention may be used in a number of devices, as stated herein,including, for example, (i) a device which uses a thermal gradient ofany kind to generate electrical power or energy output usingthermionics, thermotunneling, or other methods as described herein; (ii)a device which uses electrical power or energy to pump heat, therebycreating, maintaining, or degrading a thermal gradient usingthermionics, thermotunneling, or other methods as described herein; and(iii) as any diode which employs a gap between the anode and thecathode, or the collector and emitter, and which causes or allowselectrons to be transported between the two electrons, across or throughthe gap (with or without a vacuum in the gap). Alternatively, the deviceof the present invention may be integrated into or used for any ordinarydiode applications.

Further, when surface features of two facing surfaces of electrodes aredescribed as “matching,” it means that where one surface has anindentation, the other surface has a protrusion and vice versa. Thuswhen “matched,” the two surfaces are substantially equidistant from eachother throughout their operating range.

Referring now to FIG. 1, two electrodes 1 and 5 are separated by aregion 10 and housed in a housing 15. Electrode 1 is attached to anumber of piezo-electric actuators 20 at intervals. An electric field isapplied to the piezo-electric actuators via connecting wires 40 whichcauses them to expand or contract longitudinally, thereby altering thelongitudinal distance of region 10 between electrodes 1 and 5.Electrodes 1 and 5 are connected to capacitance controller 29, whichboth modifies the piezo-electric actuator 20, and can give feedback to apower supply/electrical load 27 to modify the heat pumping action, andgenerating action, respectively. Applying an electric field topiezo-electric actuators 20 controls the longitudinal distance of region10 between electrodes 1 and 5. The capacitance between emitter 1 andcollector 5 is measured and controlling circuitry 29 adjusts the fieldapplied to piezo-electric actuators 20 to hold the capacitance, andconsequently the distance between the electrodes 10, at a predeterminedfixed value. Alternatively, the controller 29 may be set to maximize thecapacitance and thereby minimize the distance 10 between the electrodes.The diagram shown in FIG. 1 can be used as a thermionic device and/or asa tunneling device, and can be used to function as a Power Chip and/oras a Cool Chip. Capacitance controller 29 may be composed of multipleelements, and each piezo-electric actuator 20 may receive its owndistinct signal, independent from the control of surrounding elements.

As disclosed in the foregoing, actuator elements facilitate the closepositioning of the electrodes, and if the electrode pairs are matched,then it is possible to move them into sufficiently close proximity toallow tunneling to occur. WO99/13562 and U.S. Pat. No. 6,417,060disclose methods for making pairs of electrodes whose surfaces are somatched. The present invention further improves on these processes.

The present invention describes a method for separating materials thathave been bonded together (FIGS. 2 a-e). The bonding could take manyforms. For example, one layer could have been added to another layer bydeposition, sputtering, or other method known in the art. It will beappreciated that when the term “bonding” is used herein, such term caninclude any form of adhesion that can be separated according to themethod of the present invention.

The method of the present invention may be understood by referring toFIG. 3, which shows a composite comprising two thin films deposited oneover the other using vacuum deposition methods. The composite may beseparated by the application of current, by cooling or heating, by theapplication of mechanical force, by a combination of any of the abovemethods or by any other addition or removal of energy, such as byexposure to an ultrasonic source.

The method of the present invention may be further understood byreferring to FIG. 3, in which a layer of titanium 304 is deposited onsubstrate 302. A layer of silver 306 is further deposited on the layerof titanium. A further layer of copper 308 is grown electrochemically onthe layer of silver. In a similar fashion to the processes exemplifiedin FIG. 3 b, the composite 310 shown in FIG. 3 is heated or cooled,causing it to be split into two a pair of matching electrodes. Adetailed example is given below.

Alternatively, the composite may be split by the application ofelectrical current. Typical values are of the order of 0.1 amps/cm² and0.1V.

To facilitate separation of the composite 310 into electrode pairs, thecomposite may be placed in the apparatus shown in FIG. 1, andpiezo-electric actuators 20 attached to one side of the composite, andused to draw the two apart as the composite is heated, cooled or exposedto an electric curent. This ensures that the two electrodes are then inthe correct orientation to be moved back into close juxtaposition toeach other by the piezo-electric actuators. The gap may be, for exampleless than 50 nanometers, less than 100 angstroms, or less than 50angstroms in distance.

The types of materials that can be separated in this manner are many andvarious. In one experiment, a silicon substrate was prepared and thinfilms of silver and titanium deposited upon it. The thin films wereseparated from one another by an electrical current applied through them(FIG. 2 a). In other embodiments, other materials could be substituted,or the materials could consist of thicker films or be bulk materials.Experimentally, it was found that applying liquid nitrogen to thematerials also successfully separated the respective layers (FIG. 2 b).

Experiments were conducted in which the materials began with arelatively low degree of adhesion. However, this does not imply that thepresent invention is not equally applicable were the degree of adhesionhigher, or were the materials adhered in a different manner. Variationsin the strength and duration of current and voltage, as well as theduration and temperature of thermal cycling will yield varying results.

One particularly useful embodiment involves the separation of twointended electrodes from one another, for use in vacuum diodeapplications. The two electrodes, initially bonded together, areintended to be positioned substantially opposite one another with aspacing between the two on the order of a few nanometers. The two facingsurfaces must substantially mirror one another. The method of thepresent invention allows the bonding between them to be removed withoutmoving them physically and without possibly distorting their surfaces byapplying heating or cooling or chemical methods. In this way they maysubsequently be positioned more easily for their use in vacuum diodeapplications.

In another embodiment, the initial bonded materials consist of more thantwo layers, for example two layers with a sacrificial layer in between.In some events it may be desired to separate all three materials fromone another. In other situations, just one of the layers must beseparated from the sacrificial layer by the method of the presentinvention, whilst the second layer is separated from the sacrificiallayer by a different method. In a further embodiment a mold is firstmade, and then other materials are deposited upon the mold, andsubsequently separated therefrom by the method of applying electricalcurrent or other methods of applying or removing energy, as will bedescribed. It will be appreciated that the method and materials involvedmay vary in their details without departing from the basic conceptsdisclosed herein.

Another particularly useful embodiment is to provide a mold for thecreation of electrodes or similar surfaces. An initial surface isprepared, of desired configuration. This surface is comprised of amaterial which will not be damaged by subsequent deposition of othermaterials upon it. As a particularly preferred embodiment, a seconddurable material is deposited upon the initial surface, and separatedtherefrom by the application of current or thermal stresses, asdescribed above. Then, the initial surface is used as a mold for thecreation of surfaces that mirror it identically. In the particularlypreferred embodiment, both the initial and the second materials'surfaces are used as molds, and they thus each create new surfaces thatmirror each other. If used as electrodes, these new surfaces will stillrequire positioning relative to one another, but it will likely provecost effective for surfaces to be formed using a mold in this way.

The present invention provides for the making of electrodes or othermatching pairs of surfaces. Methods for initially preparing the bondedmaterials which subsequently require separation include many techniques,such as vacuum deposition, sputtering, etc. The present invention doesnot have to be used in isolation from housing electrodes in a vacuum.For example, the bonded electrodes could be housed in a vacuum, havingelectrical connections from each, and subsequently brought out of thevacuum. Only then, applying an electrical current through the electricalconnections, would one separate the electrodes from each other.

It is anticipated that in the present embodiment example, it will benecessary to bond the housing and the electrical connections to theelectrodes with a greater degree of adhesion than that which existsbetween the electrodes. This is so that upon the application of current,it will be the electrodes that separate from one another, and not theelectrical connections or the housing separating from the electrodes.For thermal cycling, the adhesion could be made stronger, oralternatively, the TCE between the materials can be matched so thatthermal cycling introduces little or no mechanical stress on theconnection.

This feature may be used to an advantage in other embodiments. Forexample, two insulating substrates can be prepared with an indentationin the center. Two types of filling material are prepared, and one typeis deposited in each of the substrates, to fill the indentations. Thetwo substrates are then sealed, in a manner which effectively bondstogether the two filling materials to one another. However, thesubstrates and filling materials have been chosen so that the degree ofadhesion between the filling materials will be less than that betweenthe two substrates. Electrical current, cooling or heating or otherenergy is applied to the entire device, to the degree that the fillingmaterials separate from one another but the outer substrates maintaintheir seal. The result is a vacuum with two separated filling materials.One use for such a device is in vacuum diode applications.

A triode comprising three electrodes in series can similarly beprepared, beginning as three materials initially bonded together. Inother embodiments, for use as electrodes, or for a variety of uses, alarger plurality of initially bonded materials may be separatedaccording to the method of the present invention.

A related embodiment is that a substrate may be prepared, with one ormore thin films on top of it. The thin films match the TCE of thesubstrate beneath it. Subsequent thin films may be deposited before athicker layer, comprising the bulk of the second material. One pair oflayers within the sandwich will have a low adhesion, and the twosurfaces may be moved away from each other after that adhesion isbroken, either by passing an electrical current, by cooling or heatingand/or by other method of applying or removing energy to or from part ofall of the materials. It has been observed that when this occurs, itresults in an audible sound.

Thin films of materials have been experimentally separated by the methodof the present invention. However, it is anticipated that thick films orbulk materials will also be separable.

EXAMPLE

Referring to FIG. 4 a, which shows a composite intermediate 410, a dopedsilicon wafer is used as the substrate. The dopant is n type, and theconductivity of the doped silicon is on the order of 0.05 Ohm cm. A 0.1□m thick titanium film is deposited over the silicon substrate using DCmagnetron sputtering method. A round metallic mask with a diameter of 28mm is used for the titanium film deposition. After deposition, thetitanium is backed with silicon to achieve maximum adhesion of thetitanium film to the silicon substrate. Next is the in situ depositionof 1 □m thick silver film using the same method. Deposition regimes forsilver are chosen to achieve optimum adhesion of silver to the titaniumfilm. (The optimum adhesion is much less than the adhesion usually usedin microelectronics processes.) A layer of copper 500 □m thick is grownelectrochemically on the silver film. The copper is grown using ordinaryelectrochemical growth.

Next, the sandwich on the border of titanium and silver films is opened(FIG. 4 b). Once we have low adhesion between the titanium and silverfilms, the sandwich opens without considerable deformation of theelectrodes. In this way, two conformal electrodes are fabricated. Withconformal electrodes it is then possible to achieve tunneling currentsover broad areas of the electrodes.

The process uses metallic masks to define the shape of the films toavoid exposing the samples to the atmosphere. This simplifies samplepreparation and avoids problems connected with the cleaning of theelectrode surfaces.

The sandwich is opened after the sandwich is placed in a sealed area andit is pumped down. By not exposing the electrode surfaces to theatmosphere, oxidation is avoided. The sandwich is opened by cooling itdown in a vacuum from room temperature to approximately 0° C. or heatingit up to 40° C. Because copper and silicon have different ThermalExpansion Coefficients (TEC) the two electrodes separate in the processof cooling or heating. If the adhesion between the titanium and silverfilms is low enough, the sandwich opens without leaving considerabledeformation in the electrodes. On the other hand, the adhesion of silverto titanium must be high enough to prevent electrochemical liquid fromentering between the films during the electrochemical growth of copper.Precise adhesion control between the titanium and silver films istherefore important.

Thus, it is apparent that there is provided, in accordance with thepresent invention, a method for separating materials that have beenbonded together, that satisfies in each embodiment one or more of theadvantages set forth above.

While this invention has been described with reference to numerousembodiments, it is to be understood that this description is notintended to be construed in a limiting sense. Various modifications andcombinations of the illustrative embodiments will be apparent to personsskilled in the art upon reference to this description. It is to befurther understood, therefore, that numerous changes in the details ofthe embodiments of the present invention and additional embodiments ofthe present invention will be apparent to, and may be made by, personsof ordinary skill in the art having reference to this description. It iscontemplated that all such changes and additional embodiments are withinthe spirit and true scope of the invention as claimed below.

All publications and patent applications mentioned in this specificationare indicative of the level of skill of those skilled in the art towhich this invention pertains. All publications and patent applicationsare herein incorporated by reference to the same extent as if eachindividual publication or patent application was specifically andindividually indicated to be incorporated by reference.

1. A method of creating two or more pairs of surfaces that substantially mirror one another, comprising the steps of: a) providing a first substrate; b) applying thereupon a second substrate; c) separating the first and second substrates, thereby creating a first and a second mold that mirror each other; d) applying a first material to a surface of said first mold; e) applying a second material to a surface of said second mold; f) separating the materials applied in step d) and step e) from the molds whereby the materials applied in step d) and step e) comprise facing surfaces that substantially mirror one another; and g) repeating steps d) through f) as desired.
 2. The method of claim 1 wherein said separating step comprises applying an electric current between the materials and the molds.
 3. The method of claim 1 wherein said separating step comprises applying an electric current between the materials and the molds.
 4. The method of claim 1 wherein said separating step comprises heating.
 5. The method of claim 4, wherein said heating step comprises heating to a temperature of 40° C. or more.
 6. The method of claim 1 wherein said separating step comprises cooling.
 7. The method of claim 6, wherein said cooling step comprises cooling to a temperature of 0° C. or less.
 8. The method of claim 1 wherein said separating step comprises applying or removing energy.
 9. The method of claim 8 wherein said step of applying energy comprises exposing to an ultrasonic energy source.
 10. The method of claim 1 wherein said separating step comprises applying a mechanical force.
 11. The method of claim 1 wherein said separating step comprises using any combination of the following methods: a) applying an electrical current; b) cooling; c) heating; and d) forcibly separating.
 12. The method of claim 1, further comprising the steps of: a) attaching said first or second material to one or more actuators; and b) using said actuator to apply a mechanical force, thereby separating said mold and said material.
 13. The method of claim 1 in wherein said step of applying a material to a surface of a mold comprises the steps of: a) applying a material from which a surface is to be made to the mold, so that said material takes the shape of said mold, where both said material and said mold are conductors of electricity; and b) hardening said material; and c) separating said material from the mold by breaking the adhesive bond between said material and said mold.
 14. Surfaces mirroring the structure of a mold made according to the method of claim
 13. 15. A pair of matching electrodes made according to the method of claim
 1. 16. The pair of electrodes of claim 15 wherein said first electrode comprises titanium.
 17. The pair of electrodes of claim 15 wherein said second electrode comprises silver.
 18. A method of creating four surfaces, each pair of facing surfaces mirroring one another, comprising: a) preparing a first material; b) depositing thereupon a second material; c) depositing upon the second material, or on the other side of the first material, a third material; and d) applying a method to separate the three materials.
 19. Electrodes for a triode device made according to the method of claim
 18. 